Every project begins with a vision — and design goals. The materials in our palette can be used individually or combined in the same design, and even in the same layer, to satisfy your design goals for strength, hardness, corrosion resistance, conductivity, biocompatibility and more. This has enabled designers to build miniaturized mechanisms that can withstand 2,000 G’s of acceleration, run at 10,000 rpm or survive over 2,000,000 cycles of mechanical and thermal stress —all in mission-critical applications. And because they can be fabricated in highly complex structures, designers have even more options to create the small, robust, reliable devices and components that make a big difference in the world.
With an ultimate tensile strength (UTS) of 1,100 MPa, this nickel-cobalt alloy is compatible with applications requiring stainless steel.
|Ultimate Tensile Strength (MPa)||Hardness HV (Vickers)||Modulus of Elasticity (GPa)||Biocompatible|
This platinum group metal (PGM) has been optimized for implantable medical devices and precision electrical contacts.
|Ultimate Tensile Strength (MPa)||Hardness HV (Vickers)||Modulus of Elasticity (GPa)||Biocompatible Implantable|
Rhodium is a Platinum Group Metal ideal for increasing the wear resistance of moving parts. It is also highly corrosion resistant and does not oxidize, making it an excellent choice for electrical contact applications.
|Hardness HV (Vickers)|
Throughout the electronics industry, copper is the metal of choice for applications requiring electrical conductivity. Microfabrica can incorporate copper with other metals into micro-composites which have unique properties, unobtainable with a single metal.
This robust and durable polymer is an excellent match for applications requiring electrical isolation, including implantable medical devices.
|Ultimate Tensile Strength (MPa)||Dielectric Constant||Modulus of Elasticity (GPa)||Biocompatible Implantable|
Devices can be attached to an alumina substrate to provide electrical isolation and mechanical stiffness.
|Purity (%)||Dielectric Constant||Modulus of Elasticity (GPa)||Coefficient of Thermal Expansion (x10- 6m/C)|