THIS IS THE

FOUNDATION

THAT ENABLES YOU TO

BREAK DESIGN BARRIERS

AND TAKE THE

NEXT GIANT LEAP

THE FULL POTENTIAL OF YOUR DESIGNS, UNLEASHED

Semiconductor  

Heat has become a major limiting factor in semiconductor evolution. Today’s high-performance designs require advanced, complex cooling devices in order to maximize performance and reliability. Miniaturization enables thermal engineers to build smaller, more effective cooling devices and put them closer to heat sources, so the semiconductor industry can continue its progress unabated.

MORE
PERFORMANCE,
LESS SIZE AND WEIGHT

Aerospace  

Drones rely on gyroscopes and accelerometers to navigate great distances. These sophisticated mechanical sensors were once too large and heavy for use in a lightweight platform. Miniaturization allows engineers to provide this advanced performance in packages that are hundreds of times smaller, ensuring accuracy without compromising flight distance or functionality.

CREATE BETTER DEVICES,
ACHIEVE BETTER OUTCOMES

Medical Device  

Cerebral aneurysms are life-threatening abnormalities in the blood vessels of the brain. Today, physicians successfully treat aneurysms with micro-metal coils thinner than the diameter of a human hair.

3D PRINTING FLEXIBILITY AT A SEMICONDUCTOR SCALE

TECHNOLOGY  

Start with the design freedom of additive manufacturing. Add the extreme precision and high-volume production of semiconductor manufacturing. That’s innovation on an unprecedented scale.

SECURE COMPETITIVE ADVANTAGE

Company  

Time after time, scale has proven to be the key that unlocks new levels of performance — and new possibilities. Partner with us and quickly leverage the technology and expertise needed to design and build more robust, commercial components and devices that take advantage of our breakthroughs in scale and precision.

HOW WILL
YOUR IDEAS
SCALE?

Contact Us  

WHAT'S NEW

SAN JOSE, Calif., March 21, 2017 /PRNewswire/ -- Microfabrica, the world leader in Advanced Additive Manufacturing, presented performance results from their novel FINJET™ thermal management device at the SEMI-THERM 33rd Annual Symposium & Exhibit on March 15, 2017 in San Jose, CA. SEMI-THERM is an international forum dedicated to the exchange of information on the latest advances in electronics thermal management.

Continue reading

VAN NUYS, CA – March 2, 2017 – Microfabrica, the world leader in Advanced Additive Manufacturing, will present performance results from their novel thermal management device at the SEMI-THERM 33rd Annual Symposium & Exhibit held on March 15, 2017 at 11:20am in San Jose, CA. SEMI-THERM is an international forum dedicated to the exchange of information on the latest advances in electronics thermal management.

Continue reading

As everything from consumer electronics to medical devices continues to shrink, manufacturers keep running up against the problem of detail: How do you make parts and pieces that are nearly microscopic while maintaining their finer points? Microfabrica, a company based in Van Nuys, Calif., has developed a process that combines 3-D printing, wherein structures are built up layer by layer, with the same manufacturing techniques used to make computer chips, whereby metal ions are essentially electroplated to a surface.

Continue reading

WHITE PAPER

MICA FREEFORM VS. SELECTIVE LASER MELTING

A white paper comparing the MICA Freeform process to selective laser melting.

DOWNLOAD PDF More Resources