SCALE YOUR KNOWLEDGE

FEATURE GUIDE

Holes

Round holes, blind holes and counterbores – our process fabricates them as small as 40 microns in diameter while maintaining circularity. And the concentricity of inner and outer diameter features is held to +/- 2 microns (0.00008”).

Channels

Whether you need open channels, hidden channels or both, our process handles them with a width down to 30 microns (0.0012”). Depth can be as large as required or as small as 5 microns (0.0002”).

Bosses/Ribs

Feature size of bosses and ribs of any shape can be as small as 30 microns (0.0012”).

Undercuts

Our process creates undercuts with 5-micron radius internal corners, no restrictions and no need for line-of-sight access.

Mechanisms

Our process excels at fabricating extremely complex mechanisms with multiple moving parts — no assembly required. This eliminates micro-assembly costs and improves yields. Hinges, journal bearings and linear bearings are just a few examples of mechanisms our process can produce.

Dielectrics

Dielectric materials can be incorporated within our process in two ways. We can fabricate a biocompatible dielectric polymer within a metal device to provide electrical isolation. We can also fabricate three-dimensional metal devices on the surface of a 1–10mm ceramic substrate.

DESIGN RULES

Process High Aspect Ratio Standard Fine Resolution Ultra-Fine Resolution
Material Valloy-120™ Valloy-120 Palladium Valloy-120 Palladium Palladium
Minimum
Feature Size		 30 µm (0.0012") 30 µm (0.0012") 20 µm (0.0008") 10 µm (0.0004")
Minimum
Layer Thickness		 5 µm (0.0002")
Layer
Thickness Tolerance		 ±2 µm (0.00008")
Within Layer
Feature Tolerance		 ±2 µm (0.00008")
Maximum
Device Height		 ~1.25 mm (0.05")
Maximum Device
Length/Width		 ~10 mm (0.4")

RESOURCES

WHITE PAPER

MICA FREEFORM VS. SELECTIVE LASER MELTING

A white paper comparing the MICA Freeform process to selective laser melting.

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WHITE PAPER

ULTRA-PRECISION METAL ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT OF MICROELECTRONICS

A report by Ankur Jain and Adam Cohen on how our process, aka MICA Freeform, may facilitate drastically new approaches for thermal management.

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WHITE PAPER

APPLICATIONS OF MICA FREEFORM TO ANTICOUNTERFEITING

A use case comparing current anticounterfeiting solutions with those enabled by our process.

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REPORT

MATERIAL PROPERTIES

A review of key properties and attributes of Valloy-120 (a combination of nickel and cobalt) and palladium, which are featured in our process. A reference table compares these metals to other commonly used materials.

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REPORT

BIOCOMPATIBILITY REPORT

Findings from extensive research on the biocompatibility of palladium and Valloy-120. Essential information for medical device applications.

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REPORT

MANUFACTURING PROCESS

A guide for working with palladium or Valloy-120 parts produced with MICA Freeform.

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REPORT

MATERIALS DOSSIER

Includes Material Properties, Biocompatibility Report and Manufacturing Process documents.

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